The semiconductor world has a new milestone. Samsung Electronics has officially unveiled the Exynos 2600, claiming the title of the world's first smartphone chip built on a 2-nanometer (nm) manufacturing process. This launch represents a significant technological leap for Samsung, not only in its quest to power its own flagship Galaxy S26 series but also as a strategic move to showcase its advanced foundry capabilities in a direct challenge to industry leader TSMC. However, a critical design choice—the decision to forgo an integrated modem—introduces a significant variable that could impact the chip's real-world efficiency and market reception.
Samsung Takes the Lead in 2nm Mobile Chip Production
In a notable coup, Samsung has beaten rivals Qualcomm, MediaTek, and Apple to market with a 2nm mobile processor. The Exynos 2600 is fabricated using Samsung's own 2nm Gate-All-Around (GAA) process, a next-generation transistor architecture designed to improve performance and power efficiency. The chip is slated for mass production and will debut in select models of the upcoming Galaxy S26 series, expected in February 2026. This early launch is a strategic play for Samsung, aiming to capture mindshare and demonstrate its technological prowess in the fiercely competitive advanced semiconductor node race.
Exynos 2600 Key Specifications
- Process Node: Samsung 2nm GAA
- CPU: 10-core (1x 3.8 GHz Ultra + 3x 3.25 GHz Performance + 6x 2.75 GHz Efficiency)
- GPU: Xclipse 960 with hardware-accelerated ray tracing
- AI: NPU with 32K MAC, 113% claimed performance increase
- Memory: LPDDR5X support
- Modem: External Shannon 5410 (2G/3G/4G/5G/ Satellite)
- Thermal Solution: Integrated Copper Heat Path Block (HPB)
- Claimed Improvements: CPU +39%, GPU +100% compute / +50% ray tracing, Thermal +30%
- First Device: Samsung Galaxy S26 (select models, February 2026)
Performance Claims Point to a Generational Leap
Samsung has announced substantial performance improvements across the board for the Exynos 2600. The chip features a 10-core CPU configuration based on the latest Arm v9.3 architecture, reportedly delivering a 39% performance increase over its predecessor. Graphics are handled by the Xclipse 960 GPU, co-developed with AMD, which Samsung claims offers double the compute performance and up to a 50% improvement in ray-tracing capabilities. Most striking is the claimed 113% boost in AI performance from its Neural Processing Unit (NPU), enabling more complex on-device AI models. Early Geekbench scores suggest performance is competitive with last year's top-tier Android chips.
A Bold but Controversial Design: The External Modem
In a departure from industry trends for flagship SoCs, Samsung has chosen not to integrate a cellular modem directly into the Exynos 2600. Instead, the chip will rely on a separate, external Shannon 5410 modem to handle 2G through 5G and satellite connectivity. This design simplifies the manufacturing of the main Application Processor (AP), potentially improving production yields—a crucial factor for a new and complex 2nm process. However, this choice carries a major trade-off: external modems are generally less power-efficient than their integrated counterparts. This could negate some of the power-saving benefits promised by the advanced 2nm node, especially during sustained cellular data use.
An Aggressive Push in the Foundry Business
The launch of the Exynos 2600 is as much about Samsung's chip design ambitions as it is a showcase for its semiconductor manufacturing division, Samsung Foundry. With TSMC planning price hikes for its advanced nodes, Samsung is positioning itself as a cost-competitive alternative. The company has already secured a major deal to produce Tesla's next-generation AI6 chips using its 2nm process and is reportedly providing samples of its 2nm technology to Qualcomm for evaluation. Success with the Exynos 2600, particularly in proving stable yields and performance, is critical to attracting more external clients and challenging TSMC's market dominance.
Foundry & Market Context
- Samsung's Goal: Use Exynos 2600 as a "proof chip" to attract external foundry clients.
- Major Client Win: USD 165 billion deal with Tesla to produce "AI6" chips on 2nm for 2027.
- Competitive Pressure: TSMC planning 3-5% annual price hikes for advanced nodes (5nm and below) from 2026.
- Market Share Gap: Q3 2025 foundry market: TSMC ~71%, Samsung Foundry ~6.8%.
- Samsung's Reported 2nm Yield: Aiming for ~70% by early 2026, up from 50-60% in November 2025.
Addressing the Thermal Challenge Head-On
Acknowledging past criticisms of Exynos chips running hot, Samsung has introduced a new thermal solution called the Heat Path Block (HPB). This copper-based heat sink is attached directly to the processor and is part of a redesigned package that relocates the DRAM to improve heat dissipation. Samsung claims this innovation improves thermal characteristics by approximately 30% compared to the previous generation, which should help maintain higher performance levels for longer periods—a key concern for demanding mobile gaming and AI tasks.
Market Strategy and Uncertain Impact
Samsung's rollout plan for the Exynos 2600 remains cautious. Initially, it will only power the standard and Plus models of the Galaxy S26 in specific markets like South Korea. The Ultra model and phones in regions like North America and China are expected to continue using Qualcomm's Snapdragon chips. This limited deployment acts as a real-world test bed. If the chip proves successful in terms of performance, battery life, and thermal management, Samsung plans a more expansive rollout, potentially including the Galaxy S27 Ultra in 2027. The ultimate success of this 2nm gamble hinges on whether its raw processing power can outweigh the potential efficiency penalty of its external modem design.